A ground-breaking multifunctional video measuring system developed on the strength of Nikon’s leading optomechatronics technology.
Incorporates confocal technology, brightfield with a 15X zoom, and Laser AF. No matter what geometrical measurements are needed, two-dimensional or three-dimensional, inspection and evaluation is exceptionally fast and accurate.
The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages, such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.
Simultaneous wide-area height measurements with Nikon proprietary confocal optics
2D measurement with 15x brightfield zoom optics
Fully compatible with 300 mm wafer measurement at semiconductor fabs
IC Packages
Flip Chip/COF(Bump)/COG
CSP (FBGA)/SIP (Bump, Wire)
Interposer (Pad height)
MEMS
Probe Card (Silicon Probe, Au Probe)
Precise Glass Components (Micro Lens, Contact Lens)
Photo Spacer Width/Height for Color Filter for FPD Panel
A ground-breaking multifunctional video measuring system developed on the strength of Nikon’s leading optomechatronics technology.
Incorporates confocal technology, brightfield with a 15X zoom, and Laser AF. No matter what geometrical measurements are needed, two-dimensional or three-dimensional, inspection and evaluation is exceptionally fast and accurate.
The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages, such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.
Simultaneous wide-area height measurements with Nikon proprietary confocal optics
Handles printed circuit board sizes with its 650 x 550 mm stroke
IC Packages
Flip Chip/COF(Bump)/COG
CSP (FBGA)/SIP (Bump, Wire)
Interposer (Pad height)
MEMS
Probe Card (Silicon Probe, Au Probe)
Precise Glass Components (Micro Lens, Contact Lens)
Photo Spacer Width/Height for Color Filter for FPD Panel
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